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TSANG Jasmine Winglam 曾泳琳

Lecturer
wltsang@mae.cuhk.edu.hk
852 – 3943 3093
Room 302A , 3/F, Academic Building No. 1

Dr Tsang received her BEng(Honours) in Biomedical Materials Science and Engineering at Queen Mary, University of London. She then received her MSc in Dental Materials at University of Hong Kong. She had her PhD in Mechanical Engineering at Imperial College London, which is  one of the world’s top 10 university. She has been managing complicated engineering projects in a wide range of complex research challenges. She was an Associate Project Manager at PolyU Technology and Consultancy Co. Ltd before coming to CUHK, which is a leading role in both academic research projects and engineering project work. She would like to use both of her industry and academic experience to provide more insights for our students.

      

Research Interest

Publications

Publications

  1. W.L. Tsang, The use of tapered double cantilever beam (TDCB) in investigating fracture properties of particles modified epoxy, SN Applied Sciences, 2020: https://link.springer.com/article/10.1007/s42452-020-2487-8

  2. W.L. Tsang, A.C. Taylor, Fracture and toughening mechanisms of silica and core shell rubber toughened epoxy at ambient and low temperature, Journal of Materials Science, 2019: https://link.springer.com/article/10.1007/s10853-019-03893-y#citeas

  3. F.J. Guild, W.L. Tsang and A.C. Taylor, Silica particles in filled adhesive, in proceedings of “Adhesion ‘19”, Bristol, UK. 2019, London, UK: IOM Communications Ltd

  4. W.L. Tsang, PhD thesis, Fracture of particle-modified epoxies: Effect of test rate and temperature, Mechanical Engineering Department 2017, Imperial College London: https://spiral.imperial.ac.uk/handle/10044/1/75490

  5. W.L. Tsang, Master thesis, Mechanical aspects of some dental resin composites: a comparative study, University of Hong Kong, 2013: https://hub.hku.hk/handle/10722/194560

  6. F.J. Guild, W.L. Tsang, A.C. Taylor, Silica nano-particle filled polymers: Debonding and microstructure, Composites Science and Technology, Volume 218, 2022: https://doi.org/10.1016/j.compscitech.2021.109202